Relife RL-601T Middle Layer Tin Planting BGA Reballing Platform Stencils for iPhone X-17 Pro Max motherboard desoldering repair
RL-601T For X-17PM
$125.99
Sale price
$125.99
Regular price
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Relife RL-601T Middle Layer Tin Planting BGA Reballing Platform Stencils for iPhone X-17 Pro Max motherboard desoldering repair
$125.99
Sale price
$125.99
Regular price
RELIFE RL-601T 31 in 1 for iPhone X~17 Pro Max Motherboard Middle Layer Board Plant Tin Platform with 3D BGA Reballing Stencil Kit
Description
Relife RL-601T Middle Layer Tin Planting BGA Reballing Platform Set for iPhone X-17 Pro Max motherboard repair. RL-601T BGA reballing metal stencil motherboard middle frame planting tin reballing platform soldering / desoldering / reballing repair tool, Relife iPhone middle layer planting tin soldering fixture.
Features:
1. Middle layer tin planting platform set for iPhone X/XS/XS Max/11/ 11 Pro/11Pro Max/12/12 Mini/12 Pro/12Pro Max/13/13 Mini/13 Pro/13Pro Max/14/14 Plus/14 Pro/14Pro Max/15/15 Plus/15 Pro/15 Pro Max/16/16Plus/16Pro/17ProMax
2. High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls.
3. Super magnetic force / Multi-model infinite extension base / Precise positioning and close fit.
4. Anti-drum, so that each solder ball is round and full, to meet the needs of various chips.
5. Comes with precise positioning, so it is more convenient to align the holes.
6.Applicable to IP X/XS/XS Max/11/ 11Pro/11 Pro Max/12/12Mini/12 Pro/12 Pro Max/13/13Mini/13 Pro/13 Pro Max/14/14 Plus/14 Pro/14 Pro Max/15/15Plus/15 Pro/15 Pro Max/16/16 Plus/16 Pro/16 Pro Max/16e/17/17AIR/17Pro/17ProMax
Package includes:
1 x Base
7x Module Fixture
23x Steel Net
